The Future of AI Lies in Advanced Packaging Technologies

What's advanced packaging, and why's it so important?
```Packaging is the concept of connecting chips from different wafers together to create a unified computing system. Today's AI systems demand GPUs, CPUs, and high-bandwidth memory to relay information efficiently. As chipmakers adopt 'chiplets,' the need for advanced packaging technologies grows.```
Onto Innovation - Driving the Future of Advanced Packaging
```Onto makes Dragonfly wafer inspection tools crucial for advanced packaging, poised for strong growth in 2025. Their revenue from the Advanced Packaging segment is rapidly increasing, indicating a potential growth acceleration.```
Kulicke & Soffa - Emerging in Advanced Packaging
```KLIC's TCB technology and wafer-level packaging processes are set to drive significant revenue growth by 2025. With new vertical fan-out technology and opportunities in AI applications, the company is positioned for a rebound.```
This article was prepared using information from open sources in accordance with the principles of Ethical Policy. The editorial team is not responsible for absolute accuracy, as it relies on data from the sources referenced.