The Future of AI Lies in Advanced Packaging Technologies

Monday, 13 May 2024, 08:04

Nvidia is driving the AI industry, but the future growth potential lies in advanced packaging companies as AI systems demand more efficient chip connectivity. Onto Innovation and Kulicke & Soffa are two under-the-radar companies poised for significant growth in the advanced packaging sector. As the industry moves towards newer technologies like Dragonfly wafer inspection and TCB bonding, investors should keep an eye on these emerging trends in 2025.
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The Future of AI Lies in Advanced Packaging Technologies

What's advanced packaging, and why's it so important?

```Packaging is the concept of connecting chips from different wafers together to create a unified computing system. Today's AI systems demand GPUs, CPUs, and high-bandwidth memory to relay information efficiently. As chipmakers adopt 'chiplets,' the need for advanced packaging technologies grows.```

Onto Innovation - Driving the Future of Advanced Packaging

```Onto makes Dragonfly wafer inspection tools crucial for advanced packaging, poised for strong growth in 2025. Their revenue from the Advanced Packaging segment is rapidly increasing, indicating a potential growth acceleration.```

Kulicke & Soffa - Emerging in Advanced Packaging

```KLIC's TCB technology and wafer-level packaging processes are set to drive significant revenue growth by 2025. With new vertical fan-out technology and opportunities in AI applications, the company is positioned for a rebound.```


This article was prepared using information from open sources in accordance with the principles of Ethical Policy. The editorial team is not responsible for absolute accuracy, as it relies on data from the sources referenced.


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