Samsung and SK Hynix Unveil Advanced Memory Products at Shanghai's CIIE

Samsung and SK Hynix Showcase AI Memory Innovations

Samsung Electronics and SK Hynix, significant players in the memory chip sector, displayed their latest products at this year’s China International Import Expo (CIIE) in Shanghai. Positioned in the Intelligent Industry & Information Technology section, Samsung presented its GDDR7 chip, recognized as one of the most advanced memory solutions for graphics processing, alongside the HBM3E, engineered for high-performance computing and artificial intelligence (AI) projects.

Innovations and Market Response

SK Hynix introduced its revolutionary CXL Memory Module-DDR5, a dynamic random access memory (DRAM) product that can enhance bandwidth by up to 50 per cent while expanding capacity by up to 100 per cent. This exhibition underscores the considerable demand for memory components within China, which is critical given that analysts from Bank of America suggest the nation represents 30-35 per cent of global memory consumption.

Expanding Presence and Future Trends

Both companies are witnessing significant growth in sales on the mainland, reflected by boosted DRAM sales due to increased market activity. Samsung also showcased its titanium Galaxy Ring, emphasizing advancements in wearables to compete with Apple. In addition, SK Hynix presented its GDDR6-AiM, integrating processors within memory products to streamline data-processing for generative AI services.

Strategic Moves at CIIE

For the first time at CIIE, the SK Group demonstrated neural processing units developed by its subsidiary Rebellions, which recently merged with SK Telecom’s chip division. CEO Park Sung-hyun expressed ambitions to meet the data centre needs of local enterprises, ensuring further growth within the region’s AI landscape.